A new conformal coating adhesion test for electronic assembliesLING ZOU; HUNT, Chris.Soldering & surface mount technology. 2012, Vol 24, Num 1, pp 12-21, issn 0954-0911, 10 p.Article

Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer-level underfill filmYANG, Tsung-Fu; KAO, Kuo-Shu; CHENG, Ren-Chin et al.Soldering & surface mount technology. 2012, Vol 24, Num 4, pp 287-293, issn 0954-0911, 7 p.Article

Thermophysical properties and wetting behavior on Cu of selected SAC alloysFIMA, Przemyslaw; GANCARZ, Tomasz; PSTRUS, Janusz et al.Soldering & surface mount technology. 2012, Vol 24, Num 2, pp 71-76, issn 0954-0911, 6 p.Article

A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder jointsBO WANG; FENGSHUN WU; YIPING WU et al.Soldering & surface mount technology. 2011, Vol 23, Num 1, pp 40-46, issn 0954-0911, 7 p.Article

Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copperBUKAT, K; KOSCIELSKI, M; SITEK, J et al.Soldering & surface mount technology. 2011, Vol 23, Num 3, pp 150-160, issn 0954-0911, 11 p.Article

The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reductionHUANG, Chien-Yi; LIN, Yueh-Hsun; YING, Kuo-Ching et al.Soldering & surface mount technology. 2011, Vol 23, Num 4, pp 211-223, issn 0954-0911, 13 p.Article

Understanding the effects of addition of copper nanoparticles to Sn-3.5 Ag solderNADIA, Aemi; HASEEB, A. S. M. A.Soldering & surface mount technology. 2011, Vol 23, Num 2, pp 68-74, issn 0954-0911, 7 p.Article

ACF curing process optimization based on degree of cure considering contact resistance degradation of jointsBO TAO; ZHOUPING YIN; YOULUN XIONG et al.Soldering & surface mount technology. 2010, Vol 22, Num 4, pp 4-12, issn 0954-0911, 9 p.Article

An experimental and numerical investigation into the effects of the chip-on-film (COF) processing parameters on the Au-Sn bonding temperatureLIU, De-Shin; YEH, Shu-Shen; KAO, Chun-Teh et al.Soldering & surface mount technology. 2010, Vol 22, Num 4, pp 31-41, issn 0954-0911, 11 p.Article

Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic fluxZERRER, Patrick; FIX, Andreas; HUTTER, Matthias et al.Soldering & surface mount technology. 2010, Vol 22, Num 1, pp 19-25, issn 0954-0911, 7 p.Article

Effect of Bi on the microstructure and tensile behavior of Sn-3.7Ag soldersHE, M; DE LEON, N; ACOFF, V. L et al.Soldering & surface mount technology. 2010, Vol 22, Num 3, pp 4-9, issn 0954-0911, 6 p.Article

Investigation of Sn-Zn-Bi solders - Part I: surface tension, interfacial tension and density measurements of SnZn7Bi soldersBUKAT, K; MOSER, Z; SITEK, J et al.Soldering & surface mount technology. 2010, Vol 22, Num 3, pp 10-16, issn 0954-0911, 7 p.Article

Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspectiveKOKKO, Kati; HARJUNPÄÄ, Hanna; HALTIA, Anna-Maija et al.Soldering & surface mount technology. 2009, Vol 21, Num 4, pp 4-11, issn 0954-0911, 8 p.Article

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered jointsJIANBIAO PAN; CHOU, Tzu-Chien; BATH, Jasbir et al.Soldering & surface mount technology. 2009, Vol 21, Num 4, pp 32-37, issn 0954-0911, 6 p.Article

Reliability analysis of a novel fan-out type WLPYEW, Ming-Chih; TSAI, Mars; HU, Dyi-Chung et al.Soldering & surface mount technology. 2009, Vol 21, Num 3, pp 30-38, issn 0954-0911, 9 p.Article

Selected papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07)LIU, Johan; DAOQIANG LU; ANDERSSON, Cristina et al.Soldering & surface mount technology. 2009, Vol 21, Num 2, issn 0954-0911, 70 p.Conference Proceedings

The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fieldsCHENG, Cong-Qian; JIE ZHAO; YANG XU et al.Soldering & surface mount technology. 2009, Vol 21, Num 2, pp 14-18, issn 0954-0911, 5 p.Conference Paper

An investigation into the rheological properties of different lead-free solder pastes for surface mount applicationsMALLIK, S; EKERE, N. N; DURAIRAJ, R et al.Soldering & surface mount technology. 2008, Vol 20, Num 2, pp 3-10, issn 0954-0911, 8 p.Article

Board level reliability of lead-free designs of BGAs, CSPs, QFPs and TSOPsHUANG, Meng-Kuang; LEE, Chiapyng.Soldering & surface mount technology. 2008, Vol 20, Num 3, pp 18-25, issn 0954-0911, 8 p.Article

Characterization of Sn71n4.1Ag0.5Cu solder in lead-free composite solder joints of LTCC/PWB assemblyNOUSIAINEN, O; KANGASVIERI, T; RAUTIOAHO, R et al.Soldering & surface mount technology. 2008, Vol 20, Num 3, pp 11-17, issn 0954-0911, 7 p.Article

Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01AI-0.1Ga lead-free soldersLAI, R. S; LIN, K. L; SALAM, B et al.Soldering & surface mount technology. 2008, Vol 20, Num 1, pp 22-26, issn 0954-0911, 5 p.Article

Reliability study of surface mount printed circuit board assemblies with lead-free solder jointsLO, Jeffery C. C; JIA, B. F; LIU, Z et al.Soldering & surface mount technology. 2008, Vol 20, Num 2, pp 30-38, issn 0954-0911, 9 p.Article

Process and pad design optimization for 01005 passive component surface mount assemblyYU WANG; OLORUNYOMI, Michael; DAHLBERG, Martin et al.Soldering & surface mount technology. 2007, Vol 19, Num 1, pp 34-44, issn 0954-0911, 11 p.Article

Application of a design of experiments approach to the reliability of a PBGA packageJI HYUCK YANG; KANG YONG LEE.Soldering & surface mount technology. 2005, Vol 17, Num 3, pp 43-53, issn 0954-0911, 11 p.Article

A novel measurement technique for stencil printed solder pasteDUSEK, Milos; HUNT, Christopher.Soldering & surface mount technology. 2003, Vol 15, Num 2, issn 0954-0911, 5, 35-45 [12 p.]Article